Well sealed encapsulation of electronics under mild conditions possible due to low viscosity and cavity pressures.
Automation of the injection moulding process enables short cycle times and economic production. The use of Duresco Epoxy Moulding Compounds guarantees reliable, long-term use under difficult climatic conditions.

Main Advantages: protection of electronics and sensors

  • High dimension stability and thermal resistance
  • Outstanding crack-resistance in case of thermal shock
  • Improved thermal transfer due to good adhesion to inserts
  • Low water absorption combined with outstanding chemical resistance
  • Integrated housing
  • No shrink marks caused by differences in wall thickness; very low wall thicknesses are possible
  • Coefficient of thermal expansion suitable for use with the construction materials being encapsulated
  • No post cure required; minimal post shrinkage