LASER STRUCTURING FOR 3D MID
Challenge
- The use of 3D MID technology to produce injection-moulded substrates with a higher integration of electronic circuitry.
Solution
- Duresco develops materials with the following characteristics:
- Suitable for laser structuring without additives
- Maximal adhesion between substrate and copper coating
![3D MID](https://www.duresco.ch/wp-content/uploads/2020/10/IMG_0709.png)
CONTACT
![](https://www.duresco.ch/wp-content/uploads/2020/09/Duresco_Willis_klein.jpeg)
Philip Willis
+41 61 726 62 10
philip.willis@duresco.ch