LOW COEFFICIENT OF THERMAL EXPANSION
Challenge
- To encapsulate and protect electronic components and provide them with proper protection, materials with a low thermal expansion and minimal shrinkage are required.
Solution
- Duresco develops materials with the following advantages:
- Isotropic coefficient of expansion from 13 ppm/K
- Reduced mould shrinkage of approx. 0.3%
- Reduced mechanical stress during temperature changes
![COEFFICIENT OF EXPANSION](https://www.duresco.ch/wp-content/uploads/2020/10/iStock_000016045672XLarge-scaled.jpg)
CONTACT
![](https://www.duresco.ch/wp-content/uploads/2020/09/Duresco_Willis_klein.jpeg)
Philip Willis
+41 61 726 62 10
philip.willis@duresco.ch