AUTOMATION

Hermetic encapsulation with epoxy moulding compounds from Duresco



Combining low viscosity with outstanding crack resistance, Duresco thermosets are ideal for hermetically encapsulating a range of materials. Furthermore, since they are injected at low pressures, it is possible to incorporate additional electronic components in the course of a single production process. Epoxy moulding compounds from Duresco guarantee reliable, long-term service under challenging climatic conditions.

BENEFITS DURING PROCESSING



  • Moderate injection pressures
  • High flow-path/wall-thickness ratios
  • Moulding temperature adjusted to inserts
  • Limited mould shrinkage and minimal post-mould shrinkage
  • No post-curing required

BENEFITS IN END PROPERTIES



  • Good adhesion to inserts
  • Low water absorption combined with outstanding chemical resistance
  • Hermetic encapsulation
  • High thermal shock resistance
  • High thermal shock resistance